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Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
2007/7/28
期刊信息
篇名
Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
语种
英文
撰写或编译
撰写
作者
W. Zhang,C. Z. Liu,D. X. Li,M. L. Sui
第一作者单位
Institute of Metal Research, C...