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One of the more important fields of the microelectronics industry is the manufacturing of hybrid integrated circuits.An important part of the manufacturing process is concerned with the trimming of th...
Quality and reliability requirements have been boosted by the general use of complex integrated circuits. An economical and high quality production is preconditioned by the continuous checking of prim...
In this paper the possible circuit applications of thin film transistors, made by shadow masks, are discussed. Special attention is paid to the basic parameters determining the circuit properties.
A system (hardware/software) has been implemented which makes it possible, taking advantage of existing programs with the addition of suitable interfaces and appropriate software modules, to automate ...
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
The preparation of steel substrates coated with intermediate ground and final ceramic coatings is described. The basic material for the preparation of both coatings is the same kind of special glass. ...
This paper describes the application of a modern general purpose network analysis programme SPICE2 for the electrothermal analysis of hybrid integrated circuits. Self thermal coupling effects are mode...
A chronological list of 440 references on switched capacitor circuits is compiled. Such circuits have cut the cost of filters and signal processing devices for telecommunications, speech and consumer ...
Thick film technology has been known for about 20 years. The technique of inks, printing, firing and trimming has grown in this time to a well established state of the art. This paper gives an overvie...
This paper describes the thin film technology used for telecommunication circuits in the Bell System. Vacuum deposition and photolithography form the basis for the film processing steps. Nitrogen dope...
The use of thick film passive networks and hybrid integrated circuits by the Bell System is described in this paper. Included is a discussion of how attributes of thick films such as a large resistanc...
This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits (Solder Paste Process). It also describes the fine solder printing of substrate ...
In the 1970's, much development occurred in monolithic IC's and automatic insertion machines, which brought about extensive changes among mass producers of electronic consumer products and greatly inf...
A computer-aided topological hybrid layout-design procedure is proposed, that yields the wanted principal routing in the form of a geometrical planarization graph. A so-called grid-embedding of a circ...

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