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Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite Elements
Thermal Resistance Power Modules Solder Voids Finite Elements
2010/12/21
A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve ...
Design of a 108 Pin VLSI Package With Low Thermal Resistance
a 108 Pin VLSI Package Low Thermal Resistance
2010/12/27
The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high-end ...