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2022年5月23日，中科院上海微系统与信息技术研究所信息功能材料国家重点实验室狄增峰研究团队基于锗基石墨烯衬底开发出晶圆级金属电极阵列转印技术，在二维材料与金属电极的大面积无损范德华集成研究方面取得进展。相关工作于2022年5月23日以“Graphene-assisted metal transfer printing for wafer-scale integration of metal e...
The applications for gold in electrical and electronic
components are many and varied, and the quantity
used is growing steadily especially with the growth in
consumer electrical and electronic goo...
The Future of Gold in Electronics
Gold Electronics
2009/7/28
Gold-based materials have been a mainstay of the
electronics and semiconductor industry since the
physics was just a laboratory curiosity. Gold is the
workhorse material in wire bond, flip chip and...
