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Binder-less Wood Chip Insulation Panel for Building Use Made from Wood Processing Residues and Wastes IV
insulation panel wood shavings thermal conductivity thermal diffusivity heat storage capacity
2009/3/6
This paper describes thermal properties of binder-less wood chip insulation panels, focusing especially on the effect of panel thickness and on comparisons with the glass wool and phenolic foam panel...
Binder-less Wood Chip Insulation Panel for Building Use Made from Wood Processing Residues and Wastes V.
insulation panel sugi bark thermal conductivity drop impact
2009/3/6
In this series of studies, a manufacturing technology was developed which uses wood flakes or shavings for binder-less insulation panels used in buildings. This paper describes the use of sugi (Crypt...
